DAC1408D750HN-C1
vs
DAC1408D650HN
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
VFQFPN
|
QFN
|
| Package Description |
9 X 9 MM, 0.85 MM HEIGHT, PLASTIC, SOT804-3, HVQFN-64
|
HVQCCN,
|
| Pin Count |
64
|
64
|
| Manufacturer Package Code |
NLG64
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Output Voltage-Max |
3.47 V
|
3.47 V
|
| Analog Output Voltage-Min |
1.8 V
|
1.8 V
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
OFFSET BINARY, 2'S COMPLEMENT BINARY
|
OFFSET BINARY, 2'S COMPLEMENT BINARY
|
| Input Format |
SERIAL
|
SERIAL
|
| JESD-30 Code |
S-PQCC-N64
|
S-PQCC-N64
|
| JESD-609 Code |
e3
|
|
| Length |
9 mm
|
9 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Bits |
14
|
14
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
64
|
64
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Settling Time-Nom (tstl) |
0.02 µs
|
0.02 µs
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
9 mm
|
9 mm
|
| Base Number Matches |
3
|
4
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare DAC1408D750HN-C1 with alternatives
Compare DAC1408D650HN with alternatives