DAC1408D750HN
vs
DAC1408D750HN/C1,5
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
NXP SEMICONDUCTORS
|
Package Description |
HVQCCN,
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
|
Analog Output Voltage-Max |
3.47 V
|
|
Analog Output Voltage-Min |
1.8 V
|
|
Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
Input Bit Code |
OFFSET BINARY, 2'S COMPLEMENT BINARY
|
OFFSET BINARY, 2'S COMPLEMENT BINARY
|
Input Format |
SERIAL
|
|
JESD-30 Code |
S-PQCC-N64
|
S-PQCC-N64
|
Length |
9 mm
|
|
Number of Bits |
14
|
14
|
Number of Functions |
1
|
2
|
Number of Terminals |
64
|
64
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
QCCN
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER
|
Seated Height-Max |
1 mm
|
|
Settling Time-Nom (tstl) |
0.02 µs
|
|
Supply Voltage-Nom |
1.8 V
|
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
9 mm
|
|
Base Number Matches |
4
|
1
|
Rohs Code |
|
Yes
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
1
|
Package Equivalence Code |
|
LCC64,.35SQ,20
|
Qualification Status |
|
Not Qualified
|
Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare DAC1408D750HN with alternatives
Compare DAC1408D750HN/C1,5 with alternatives