DAC121S101WGMPR
vs
DAC121S101CIMMX
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
TEXAS INSTRUMENTS INC
|
| Package Description |
CERAMIC, SOIC-10
|
TSSOP, TSSOP8,.19
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Output Voltage-Max |
5.5 V
|
5.5 V
|
| Analog Output Voltage-Min |
|
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY
|
BINARY
|
| Input Format |
SERIAL
|
SERIAL
|
| JESD-30 Code |
R-CDSO-G10
|
S-PDSO-G8
|
| JESD-609 Code |
e0
|
e0
|
| Length |
6.86 mm
|
3 mm
|
| Linearity Error-Max (EL) |
0.1953%
|
0.1953%
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
10
|
8
|
| Operating Temperature-Max |
125 °C
|
105 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
TSSOP
|
| Package Equivalence Code |
SOP10,.4
|
TSSOP8,.19
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.33 mm
|
1.1 mm
|
| Settling Time-Nom (tstl) |
12.5 µs
|
12 µs
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
6.12 mm
|
3 mm
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
MSOP
|
| Pin Count |
|
8
|
| Settling Time-Max |
|
10 µs
|
| Supply Current-Max |
|
0.312 mA
|
|
|
|
Compare DAC121S101CIMMX with alternatives