DAC1208D750HN
vs
DAC1408D750HN-C18
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Package Description |
,
|
9 X 9 MM, 0.85 MM HEIGHT, PLASTIC, SOT804-3, HVQFN-64
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Number of Bits |
12
|
14
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
VFQFPN
|
| Pin Count |
|
64
|
| Manufacturer Package Code |
|
NLG64
|
| Analog Output Voltage-Max |
|
3.47 V
|
| Analog Output Voltage-Min |
|
1.8 V
|
| Input Bit Code |
|
OFFSET BINARY, 2'S COMPLEMENT BINARY
|
| Input Format |
|
SERIAL
|
| JESD-30 Code |
|
S-PQCC-N64
|
| JESD-609 Code |
|
e3
|
| Length |
|
9 mm
|
| Moisture Sensitivity Level |
|
3
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
64
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
HVQCCN
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
1 mm
|
| Settling Time-Nom (tstl) |
|
0.02 µs
|
| Supply Voltage-Nom |
|
1.8 V
|
| Surface Mount |
|
YES
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Form |
|
NO LEAD
|
| Terminal Pitch |
|
0.5 mm
|
| Terminal Position |
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
9 mm
|
|
|
|
Compare DAC1208D750HN with alternatives
Compare DAC1408D750HN-C18 with alternatives