D27C512-200V10
vs
D27512-200V05
feature comparison
Part Life Cycle Code |
Contact Manufacturer
|
Obsolete
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
INTEL CORP
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.61
|
8542.32.00.61
|
Memory IC Type |
UVPROM
|
UVPROM
|
Base Number Matches |
2
|
2
|
Rohs Code |
|
No
|
Package Description |
|
DIP, DIP28,.6
|
Access Time-Max |
|
200 ns
|
I/O Type |
|
COMMON
|
JESD-30 Code |
|
R-XDIP-T28
|
JESD-609 Code |
|
e0
|
Memory Density |
|
524288 bit
|
Memory Width |
|
8
|
Number of Terminals |
|
28
|
Number of Words |
|
65536 words
|
Number of Words Code |
|
64000
|
Operating Mode |
|
ASYNCHRONOUS
|
Operating Temperature-Max |
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
|
64KX8
|
Output Characteristics |
|
3-STATE
|
Package Body Material |
|
CERAMIC
|
Package Code |
|
DIP
|
Package Equivalence Code |
|
DIP28,.6
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
IN-LINE
|
Parallel/Serial |
|
PARALLEL
|
Qualification Status |
|
Not Qualified
|
Supply Current-Max |
|
0.125 mA
|
Supply Voltage-Nom (Vsup) |
|
5 V
|
Surface Mount |
|
NO
|
Technology |
|
MOS
|
Temperature Grade |
|
COMMERCIAL
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
|
THROUGH-HOLE
|
Terminal Pitch |
|
2.54 mm
|
Terminal Position |
|
DUAL
|
|
|
|
Compare D27C512-200V10 with alternatives
Compare D27512-200V05 with alternatives