D12AP200910R5%B5 vs RK73A2ALTDD911J feature comparison

D12AP200910R5%B5 Vishay Intertechnologies

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RK73A2ALTDD911J KOA Speer Electronics Inc

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Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer VISHAY INTERTECHNOLOGY INC KOA SPEER ELECTRONICS INC
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
Construction Chip Chip
JESD-609 Code e4 e0
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.45 mm 0.5 mm
Package Length 2 mm 2 mm
Package Style SMT SMT
Package Width 1.25 mm 1.25 mm
Packing Method TR, Blister, 7 Inch TR, PAPER, 10 INCH
Rated Power Dissipation (P) 0.125 W 0.125 W
Resistance 910 Ω 910 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0805 0805
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 200 ppm/°C 200 ppm/°C
Terminal Finish Silver/Palladium (Ag/Pd) Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 5% 5%
Working Voltage 150 V 150 V
Base Number Matches 1 1
Pbfree Code No
Package Description CHIP
HTS Code 8533.21.00.30
Package Shape RECTANGULAR PACKAGE
Rated Temperature 70 °C

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