CYRF7936-40LTXC
vs
MCRF355/WB
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
QFN
|
WAFER
|
| Package Description |
QFN-40
|
0.008 INCH, BACKGRIND, BUMP, WAFER-6
|
| Pin Count |
40
|
6
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-XQCC-N40
|
R-XUUC-N6
|
| JESD-609 Code |
e4
|
e3
|
| Length |
6 mm
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
40
|
6
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
-20 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
DIE
|
| Package Equivalence Code |
LCC40,.24SQ,20
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
UNCASED CHIP
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
|
| Supply Voltage-Nom |
2.4 V
|
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
TELECOM CIRCUIT
|
TELECOM CIRCUIT
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
UPPER
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Width |
6 mm
|
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Technology |
|
CMOS
|
|
|
|
Compare CYRF7936-40LTXC with alternatives
Compare MCRF355/WB with alternatives