MCRF355/WB
vs
MCRF355/WFB
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
WAFER
|
WAFER
|
Package Description |
0.008 INCH, BACKGRIND, BUMP, WAFER-6
|
0.008 INCH, BACKGRIND, BUMP, WAFER-6
|
Pin Count |
6
|
6
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
R-XUUC-N6
|
R-XUUC-N6
|
JESD-609 Code |
e3
|
e3
|
Number of Functions |
1
|
1
|
Number of Terminals |
6
|
6
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
-20 °C
|
-20 °C
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
DIE
|
DIE
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
UNCASED CHIP
|
UNCASED CHIP
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Telecom IC Type |
TELECOM CIRCUIT
|
TELECOM CIRCUIT
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Position |
UPPER
|
UPPER
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MCRF355/WB with alternatives
Compare MCRF355/WFB with alternatives