We use Cookies to give you best experience on our website. By using our website and services, you expressly agree to the placement of our performance, functionality and advertising cookies. Please see our Privacy Policy for more information.

Register or Sign In

CYD18S18V18-250BBXC vs CYD18S18V18-200BBXC feature comparison

CYD18S18V18-250BBXC Cypress Semiconductor

Buy Now Datasheet

CYD18S18V18-200BBXC Cypress Semiconductor

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description 19 X 19 MM, 1.70 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-256 LBGA, BGA256,16X16,40
Pin Count 256 256
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 7.2 ns 9 ns
Additional Feature PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V
Clock Frequency-Max (fCLK) 250 MHz 200 MHz
I/O Type COMMON COMMON
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e1
Length 19 mm 19 mm
Memory Density 18874368 bit 18874368 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 18 18
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 256 256
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX18 1MX18
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Standby Current-Max 0.3 A 0.3 A
Standby Voltage-Min 1.4 V 1.4 V
Supply Current-Max 0.88 mA 0.77 mA
Supply Voltage-Max (Vsup) 1.58 V 1.58 V
Supply Voltage-Min (Vsup) 1.42 V 1.42 V
Supply Voltage-Nom (Vsup) 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20 20
Width 19 mm 19 mm
Base Number Matches 1 1
Memory » SRAMs
Memory » SRAMs

Compare CYD18S18V18-250BBXC with alternatives

Compare CYD18S18V18-200BBXC with alternatives