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CYD18S18V18-250BBXC vs CYD18S18V18-200BBAXI feature comparison

CYD18S18V18-250BBXC Cypress Semiconductor

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CYD18S18V18-200BBAXI Cypress Semiconductor

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description 19 X 19 MM, 1.70 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-256 17 X 17 MM, 1.70 MM HEIGHT, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256
Pin Count 256 256
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 7.2 ns 3.3 ns
Additional Feature PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V
Clock Frequency-Max (fCLK) 250 MHz 200 MHz
I/O Type COMMON COMMON
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e1
Length 19 mm 17 mm
Memory Density 18874368 bit 18874368 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 18 18
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 256 256
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1MX18 1MX18
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Standby Current-Max 0.3 A 0.35 A
Standby Voltage-Min 1.4 V 1.4 V
Supply Current-Max 0.88 mA 0.83 mA
Supply Voltage-Max (Vsup) 1.58 V 1.58 V
Supply Voltage-Min (Vsup) 1.42 V 1.42 V
Supply Voltage-Nom (Vsup) 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20 20
Width 19 mm 17 mm
Base Number Matches 1 1
Memory » SRAMs
Memory » SRAMs

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