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CYD04S72V18-250BGXC vs CYD04S72V18-250BGC feature comparison

CYD04S72V18-250BGXC Cypress Semiconductor

Buy Now Datasheet

CYD04S72V18-250BGC Cypress Semiconductor

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description 23 X 23 MM, 2.03 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-484 23 X 23 MM, 2.03 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-484
Pin Count 484 484
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 7.2 ns 7.2 ns
Additional Feature PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V
Clock Frequency-Max (fCLK) 250 MHz 250 MHz
I/O Type COMMON COMMON
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e1 e0
Length 23 mm 23 mm
Memory Density 4718592 bit 4718592 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 72 72
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 484 484
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 64KX72 64KX72
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA484,22X22,40 BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.16 mm 2.16 mm
Standby Current-Max 0.15 A 0.15 A
Standby Voltage-Min 1.4 V 1.4 V
Supply Current-Max 0.88 mA 0.88 mA
Supply Voltage-Max (Vsup) 1.58 V 1.58 V
Supply Voltage-Min (Vsup) 1.42 V 1.42 V
Supply Voltage-Nom (Vsup) 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20 NOT SPECIFIED
Width 23 mm 23 mm
Base Number Matches 1 1
Memory » SRAMs
Memory » SRAMs

Compare CYD04S72V18-250BGXC with alternatives

Compare CYD04S72V18-250BGC with alternatives