CY7C9101-35GMB
vs
CY7C9101-45DMB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
CYPRESS SEMICONDUCTOR CORP
Part Package Code
PGA
DIP
Package Description
CERAMIC, PGA-68
0.900 INCH, BOTTOMBRAZED, DIP-64
Pin Count
68
64
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A001.A.2.C
HTS Code
8542.31.00.01
8542.31.00.01
Clock Frequency-Max
28.57 MHz
22.2 MHz
External Data Bus Width
9
9
JESD-30 Code
S-CPGA-P68
R-CDIP-T64
JESD-609 Code
e0
e0
Length
27.94 mm
81.28 mm
Number of Terminals
68
64
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
PGA
DIP
Package Equivalence Code
PGA68,11X11
DIP64,.9
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
38535Q/M;38534H;883B
Seated Height-Max
2.667 mm
5.08 mm
Supply Current-Max
85 mA
85 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
PIN/PEG
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
PERPENDICULAR
DUAL
Width
27.94 mm
22.86 mm
uPs/uCs/Peripheral ICs Type
BIT-SLICE MICROPROCESSOR
BIT-SLICE MICROPROCESSOR
Base Number Matches
1
1
Compare CY7C9101-35GMB with alternatives
Compare CY7C9101-45DMB with alternatives