CY7C516-75DMB
vs
CY7C516-75GC
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
PGA
|
| Package Description |
0.900 INCH, BOTTOM BRAZED, CERAMIC, DIP-64
|
CAVITY-DOWN, CERAMIC, PGA-68
|
| Pin Count |
64
|
68
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
13.3 MHz
|
13.3 MHz
|
| External Data Bus Width |
16
|
16
|
| JESD-30 Code |
R-CDIP-T64
|
S-CPGA-P68
|
| JESD-609 Code |
e0
|
e0
|
| Length |
81.28 mm
|
27.94 mm
|
| Low Power Mode |
NO
|
NO
|
| Number of Terminals |
64
|
68
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Output Data Bus Width |
32
|
32
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
PGA
|
| Package Equivalence Code |
DIP64,.9
|
PGA68,11X11
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Current-Max |
110 mA
|
100 mA
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
PIN/PEG
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
PERPENDICULAR
|
| Width |
22.86 mm
|
27.94 mm
|
| uPs/uCs/Peripheral ICs Type |
DSP PERIPHERAL, MULTIPLIER
|
DSP PERIPHERAL, MULTIPLIER
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare CY7C516-75DMB with alternatives
Compare CY7C516-75GC with alternatives