CY7C225A-18DI
vs
53RA481AJS883B
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
Part Package Code
DIP
Package Description
DIP,
Pin Count
24
Reach Compliance Code
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.71
Access Time-Max
12 ns
JESD-30 Code
R-GDIP-T24
Memory Density
4096 bit
Memory IC Type
OTP ROM
Memory Width
8
Number of Functions
1
Number of Terminals
24
Number of Words
512 words
Number of Words Code
512
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
512X8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
THROUGH-HOLE
Terminal Position
DUAL
Base Number Matches
1
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