CY7C197-55DMB
vs
5962-8872503LA
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TELEDYNE E2V (UK) LTD
|
TELEDYNE E2V (UK) LTD
|
Package Description |
,
|
DIP, DIP24,.3
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
3A001.A.2.C
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
55 ns
|
55 ns
|
I/O Type |
SEPARATE
|
SEPARATE
|
JESD-30 Code |
R-GDIP-T24
|
R-GDIP-T24
|
Length |
31.877 mm
|
|
Memory Density |
262144 bit
|
262144 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
|
Number of Terminals |
24
|
24
|
Number of Words |
262144 words
|
262144 words
|
Number of Words Code |
256000
|
256000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Organization |
256KX1
|
256KX1
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Enable |
NO
|
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP24,.3
|
DIP24,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Screening Level |
MIL-STD-883 Class C
|
38535Q/M;38534H;883B
|
Seated Height-Max |
5.08 mm
|
|
Standby Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Max (Vsup) |
5.5 V
|
|
Supply Voltage-Min (Vsup) |
4.5 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.62 mm
|
|
Base Number Matches |
1
|
1
|
JESD-609 Code |
|
e0
|
Qualification Status |
|
Qualified
|
Standby Current-Max |
|
0.02 A
|
Supply Current-Max |
|
0.12 mA
|
Temperature Grade |
|
MILITARY
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare CY7C197-55DMB with alternatives
Compare 5962-8872503LA with alternatives