CY7C197-35PC vs EDI81256LP35FI feature comparison

CY7C197-35PC Cypress Semiconductor

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EDI81256LP35FI Electronic Designs Inc

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP ELECTRONIC DESIGNS INC
Part Package Code DIP
Package Description 0.300 INCH, PLASTIC, DIP-24
Pin Count 24
Reach Compliance Code not_compliant unknown
ECCN Code EAR99
HTS Code 8542.32.00.41
Access Time-Max 35 ns 35 ns
Additional Feature AUTOMATIC POWER-DOWN
I/O Type SEPARATE
JESD-30 Code R-PDIP-T24 R-CDFP-F28
JESD-609 Code e0
Length 30.099 mm
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 1 1
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 24 28
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 256KX1 256KX1
Output Characteristics 3-STATE 3-STATE
Output Enable NO NO
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DFP
Package Equivalence Code DIP24,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE FLATPACK
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.826 mm
Standby Current-Max 0.02 A
Standby Voltage-Min 4.5 V 2 V
Supply Current-Max 0.1 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE FLAT
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 1

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Compare EDI81256LP35FI with alternatives