CY7C194-25KMB
vs
5962-9461114HMX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
MERCURY SYSTEMS INC
Package Description
DFP,
QFP,
Reach Compliance Code
unknown
compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
25 ns
Additional Feature
AUTOMATIC POWER-DOWN
JESD-30 Code
R-CDFP-F24
S-CQFP-G68
Length
15.367 mm
22.352 mm
Memory Density
262144 bit
16777216 bit
Memory IC Type
STANDARD SRAM
SRAM MODULE
Memory Width
4
32
Number of Functions
1
1
Number of Terminals
24
68
Number of Words
65536 words
524288 words
Number of Words Code
64000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
64KX4
512KX32
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DFP
QFP
Package Shape
RECTANGULAR
SQUARE
Package Style
FLATPACK
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
2.286 mm
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
FLAT
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
9.652 mm
22.352 mm
Base Number Matches
1
1
JESD-609 Code
e0
Qualification Status
Not Qualified
Screening Level
MIL-STD-883
Terminal Finish
TIN LEAD
Compare CY7C194-25KMB with alternatives
Compare 5962-9461114HMX with alternatives