CY7C1526KV18-333BZXC
vs
GS8662D10BGD-300
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
parentfamilyid
2350458
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
GSI TECHNOLOGY
Part Package Code
BGA
BGA
Package Description
13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
LBGA,
Pin Count
165
165
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.B
HTS Code
8542.32.00.41
8542.32.00.41
Total Weight
589
473.86
Category CO2 Kg
12
12
CO2
7068
5686.32
Compliance Temperature Grade
Commercial: +0C to +70C
Commercial: +0C to +70C
EU RoHS Version
RoHS 2 (2015/863/EU)
RoHS 2 (2015/863/EU)
Candidate List Date
2021-07-08
2024-01-23
CAS Accounted for Wt
89
88
CA Prop 65 Presence
YES
YES
CA Prop 65 CAS Numbers
7440-02-0
80-05-7, 7440-02-0
EFUP
e
Conflict Mineral Status
DRC Conflict Free
DRC Conflict Free
Conflict Mineral Status Source
CMRT V5.10
CMRT V6.31
Access Time-Max
0.45 ns
0.45 ns
Additional Feature
PIPELINED ARCHITECTURE
PIPELINE ARCHITECTURE
Clock Frequency-Max (fCLK)
333 MHz
I/O Type
SEPARATE
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
JESD-609 Code
e1
e1
Length
15 mm
15 mm
Memory Density
75497472 bit
75497472 bit
Memory IC Type
QDR SRAM
DDR SRAM
Memory Width
9
9
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
165
165
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
8MX9
8MX9
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA165,11X15,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.4 mm
Standby Current-Max
0.29 A
Standby Voltage-Min
1.7 V
Supply Current-Max
0.6 mA
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
NOT SPECIFIED
Width
13 mm
13 mm
Base Number Matches
2
1
Factory Lead Time
24 Weeks
Compare CY7C1526KV18-333BZXC with alternatives
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