CY7C1526KV18-333BZXC
vs
GS8662T09E-300
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
GSI TECHNOLOGY
Part Package Code
BGA
BGA
Package Description
13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
15 X 17 MM, 1MM PITCH, FPBGA-165
Pin Count
165
165
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
0.45 ns
0.45 ns
Additional Feature
PIPELINED ARCHITECTURE
PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
333 MHz
I/O Type
SEPARATE
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
JESD-609 Code
e1
Length
15 mm
17 mm
Memory Density
75497472 bit
75497472 bit
Memory IC Type
QDR SRAM
DDR SRAM
Memory Width
9
9
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
165
165
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
8MX9
8MX9
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA165,11X15,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
235
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.5 mm
Standby Current-Max
0.29 A
Standby Voltage-Min
1.7 V
Supply Current-Max
0.6 mA
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Width
13 mm
15 mm
Base Number Matches
2
1
Pbfree Code
Compare CY7C1526KV18-333BZXC with alternatives
Compare GS8662T09E-300 with alternatives