CY7C1525AV18-167BZI vs GS8662R09GE-250I feature comparison

CY7C1525AV18-167BZI Cypress Semiconductor

Buy Now Datasheet

GS8662R09GE-250I GSI Technology

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 LBGA,
Pin Count 165 165
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 0.5 ns 0.45 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 167 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B165 R-PBGA-B165
JESD-609 Code e0 e1
Length 17 mm 17 mm
Memory Density 75497472 bit 75497472 bit
Memory IC Type QDR SRAM DDR SRAM
Memory Width 9 9
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8MX9 8MX9
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 220 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.5 mm
Standby Voltage-Min 1.7 V
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 15 mm 15 mm
Base Number Matches 1 1

Compare CY7C1525AV18-167BZI with alternatives

Compare GS8662R09GE-250I with alternatives