Part Details for GS8662R09GE-250I by GSI Technology
Overview of GS8662R09GE-250I by GSI Technology
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
LTC2250IUH#PBF | Analog Devices | 10-B, 105Msps L N 3V ADCs | |
LTC2250IUH#TRPBF | Analog Devices | 10-B, 105Msps L N 3V ADCs | |
MSP430FG4250IRGZR | Texas Instruments | 16-Bit Ultra-Low-Power MCU, 16kB Flash, 256B RAM, 16-bit Sigma-Delta A/D, 12-bit D/A, 2 OPAMP, LCD 48-VQFN -40 to 85 |
Part Details for GS8662R09GE-250I
GS8662R09GE-250I CAD Models
GS8662R09GE-250I Part Data Attributes
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GS8662R09GE-250I
GSI Technology
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Datasheet
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GS8662R09GE-250I
GSI Technology
DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 MM X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | GSI TECHNOLOGY | |
Part Package Code | BGA | |
Package Description | LBGA, | |
Pin Count | 165 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 0.45 ns | |
Additional Feature | PIPELINED ARCHITECTURE | |
JESD-30 Code | R-PBGA-B165 | |
JESD-609 Code | e1 | |
Length | 17 mm | |
Memory Density | 75497472 bit | |
Memory IC Type | DDR SRAM | |
Memory Width | 9 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 8388608 words | |
Number of Words Code | 8000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 8MX9 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.5 mm | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 15 mm |
Alternate Parts for GS8662R09GE-250I
This table gives cross-reference parts and alternative options found for GS8662R09GE-250I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8662R09GE-250I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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GS8662R09E-250 | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 MM X 17 MM, 1MM PITCH, FPBGA-165 | GSI Technology | GS8662R09GE-250I vs GS8662R09E-250 |
UPD44644094F5-E40-FQ1 | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, PLASTIC, BGA-165 | NEC Electronics Group | GS8662R09GE-250I vs UPD44644094F5-E40-FQ1 |
GS8662R09E-250T | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 MM X 17 MM, 1MM PITCH, FPBGA-165 | GSI Technology | GS8662R09GE-250I vs GS8662R09E-250T |
CY7C1528V18-250BZI | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | GS8662R09GE-250I vs CY7C1528V18-250BZI |
CY7C1528V18-250BZXI | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | GS8662R09GE-250I vs CY7C1528V18-250BZXI |
CY7C1528V18-250BZXC | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | GS8662R09GE-250I vs CY7C1528V18-250BZXC |
GS8662R09GE-250IT | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 MM X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8662R09GE-250I vs GS8662R09GE-250IT |
GS8662R09GE-250T | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 MM X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8662R09GE-250I vs GS8662R09GE-250T |
GS8662R09E-250I | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 MM X 17 MM, 1MM PITCH, FPBGA-165 | GSI Technology | GS8662R09GE-250I vs GS8662R09E-250I |
CY7C1528V18-250BZC | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | GS8662R09GE-250I vs CY7C1528V18-250BZC |