CY7C1515JV18-167BZI
vs
IS61QDP2B42M36A1-300M3L
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
INTEGRATED SILICON SOLUTION INC
Part Package Code
BGA
Package Description
15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
LBGA, BGA165,11X15,40
Pin Count
165
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
0.5 ns
0.45 ns
Additional Feature
PIPELINED ARCHITECTURE
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
Length
17 mm
17 mm
Memory Density
75497472 bit
75497472 bit
Memory IC Type
QDR SRAM
QDR SRAM
Memory Width
36
36
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
165
165
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
2MX36
2MX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.4 mm
Supply Voltage-Max (Vsup)
1.9 V
1.89 V
Supply Voltage-Min (Vsup)
1.7 V
1.71 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
15 mm
15 mm
Base Number Matches
1
1
Clock Frequency-Max (fCLK)
300 MHz
I/O Type
SEPARATE
Output Characteristics
3-STATE
Package Equivalence Code
BGA165,11X15,40
Standby Current-Max
0.32 A
Standby Voltage-Min
1.7 V
Supply Current-Max
1 mA
Compare CY7C1515JV18-167BZI with alternatives
Compare IS61QDP2B42M36A1-300M3L with alternatives