CY7C1480V33-167BZC
vs
GS864236GE-300I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
GSI TECHNOLOGY
Part Package Code
BGA
BGA
Package Description
15 X 17 MM, 1.40 MM HEIGHT, FBGA-165
BGA,
Pin Count
165
165
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
3.4 ns
5.5 ns
Additional Feature
PIPELINED ARCHITECTURE
FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY
Clock Frequency-Max (fCLK)
167 MHz
I/O Type
COMMON
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
JESD-609 Code
e0
e1
Length
17 mm
17 mm
Memory Density
75497472 bit
75497472 bit
Memory IC Type
CACHE SRAM
CACHE SRAM
Memory Width
36
36
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
165
165
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
2MX36
2MX36
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Equivalence Code
BGA165,11X15,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
Standby Voltage-Min
3.14 V
Supply Voltage-Max (Vsup)
3.6 V
2.7 V
Supply Voltage-Min (Vsup)
3.135 V
2.3 V
Supply Voltage-Nom (Vsup)
3.3 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
15 mm
15 mm
Base Number Matches
1
2
Pbfree Code
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