Part Details for GS864236GE-300I by GSI Technology
Overview of GS864236GE-300I by GSI Technology
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (4 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Space Technology
Aerospace and Defense
Energy and Power Systems
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| EL8300IUZ | Renesas Electronics Corporation | 200MHz Rail-to-Rail Amplifier, QSOP, /Tube | |
| ISL68300IRAZ-TK | Renesas Electronics Corporation | Scalable Single Output Digital PWM Controller with Integrated Driver and PMBus | |
| EL8300IU-T13 | Renesas Electronics Corporation | 200MHz Rail-to-Rail Amplifier, QSOP, /Reel |
Part Details for GS864236GE-300I
GS864236GE-300I CAD Models
GS864236GE-300I Part Data Attributes
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GS864236GE-300I
GSI Technology
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Datasheet
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GS864236GE-300I
GSI Technology
Cache SRAM, 2MX36, 5.5ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FBGA-165
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | GSI TECHNOLOGY | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 165 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 5.5 ns | |
| Additional Feature | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e1 | |
| Length | 17 mm | |
| Memory Density | 75497472 bit | |
| Memory IC Type | CACHE SRAM | |
| Memory Width | 36 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 2MX36 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 2.7 V | |
| Supply Voltage-Min (Vsup) | 2.3 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 15 mm |
Alternate Parts for GS864236GE-300I
This table gives cross-reference parts and alternative options found for GS864236GE-300I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS864236GE-300I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| GS864236GE-300 | Cache SRAM, 2MX36, 5.5ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FBGA-165 | GSI Technology | GS864236GE-300I vs GS864236GE-300 |
| GS864236E-300IT | Cache SRAM, 2MX36, 5.5ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FBGA-165 | GSI Technology | GS864236GE-300I vs GS864236E-300IT |
| GS864236GE-300IT | Cache SRAM, 2MX36, 5.5ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FBGA-165 | GSI Technology | GS864236GE-300I vs GS864236GE-300IT |
| GS864236E-300 | Cache SRAM, 2MX36, 5.5ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FBGA-165 | GSI Technology | GS864236GE-300I vs GS864236E-300 |