CY7C1474V33-250BGXI
vs
GS8644Z72GC-150I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
GSI TECHNOLOGY
Part Package Code
BGA
BGA
Package Description
14 X 22 MM, 1.76 MM HEIGHT, LEAD FREE, FBGA-209
LBGA,
Pin Count
209
209
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
3 ns
7.5 ns
Additional Feature
PIPELINED ARCHITECTURE
ALSO OPERATES AT 3.3V SUPPLY; PIPELINED OR FLOW-THROUGH ARCHITECTURE
Clock Frequency-Max (fCLK)
250 MHz
I/O Type
COMMON
JESD-30 Code
R-PBGA-B209
R-PBGA-B209
JESD-609 Code
e1
e1
Length
22 mm
22 mm
Memory Density
75497472 bit
75497472 bit
Memory IC Type
ZBT SRAM
ZBT SRAM
Memory Width
72
72
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
209
209
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
1MX72
1MX72
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Equivalence Code
BGA209,11X19,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.96 mm
1.7 mm
Standby Voltage-Min
3.14 V
Supply Voltage-Max (Vsup)
3.63 V
2.7 V
Supply Voltage-Min (Vsup)
3.135 V
2.3 V
Supply Voltage-Nom (Vsup)
3.3 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Width
14 mm
14 mm
Base Number Matches
1
1
Pbfree Code
Compare CY7C1474V33-250BGXI with alternatives
Compare GS8644Z72GC-150I with alternatives