CY7C1474V33-250BGXI
vs
CY7C1474V33-250BGI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
14 X 22 MM, 1.76 MM HEIGHT, LEAD FREE, FBGA-209
14 X 22 MM, 1.76 MM HEIGHT, FBGA-209
Pin Count
209
209
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
3 ns
3 ns
Additional Feature
PIPELINED ARCHITECTURE
PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
250 MHz
250 MHz
I/O Type
COMMON
COMMON
JESD-30 Code
R-PBGA-B209
R-PBGA-B209
JESD-609 Code
e1
e0
Length
22 mm
22 mm
Memory Density
75497472 bit
75497472 bit
Memory IC Type
ZBT SRAM
ZBT SRAM
Memory Width
72
72
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
209
209
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
1MX72
1MX72
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA209,11X19,40
BGA209,11X19,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.96 mm
1.96 mm
Standby Voltage-Min
3.14 V
3.14 V
Supply Voltage-Max (Vsup)
3.63 V
3.63 V
Supply Voltage-Min (Vsup)
3.135 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Width
14 mm
14 mm
Base Number Matches
1
1
Compare CY7C1474V33-250BGXI with alternatives
Compare CY7C1474V33-250BGI with alternatives