CY7C1474V25-167BX vs GS864272C-167IVT feature comparison

CY7C1474V25-167BX Cypress Semiconductor

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GS864272C-167IVT GSI Technology

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP GSI TECHNOLOGY
Package Description BGA, BGA209,11X19,40 LBGA,
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3.4 ns 8 ns
Clock Frequency-Max (fCLK) 167 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B209 R-PBGA-B209
Memory Density 75497472 bit 75497472 bit
Memory IC Type APPLICATION SPECIFIC SRAM CACHE SRAM
Memory Width 72 72
Number of Terminals 209 209
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1MX72 1MX72
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA209,11X19,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Voltage-Min 2.38 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Part Package Code BGA
Pin Count 209
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY
Length 22 mm
Number of Functions 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 1.7 mm
Supply Voltage-Max (Vsup) 2 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 14 mm

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