CY7C1472BV33-200BZXC vs GS864418GE-133 feature comparison

CY7C1472BV33-200BZXC Infineon Technologies AG

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GS864418GE-133 GSI Technology

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Rohs Code Yes Yes
Part Life Cycle Code End Of Life Active
Ihs Manufacturer INFINEON TECHNOLOGIES AG GSI TECHNOLOGY
Package Description FBGA-165 LBGA,
Reach Compliance Code compliant compliant
Factory Lead Time 11 Weeks 24 Weeks
Samacsys Manufacturer Infineon GSI TECHNOLOGY
Access Time-Max 3 ns 8.5 ns
Additional Feature PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES WITH 3.3V SUPPLY
Clock Frequency-Max (fCLK) 200 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B165 R-PBGA-B165
JESD-609 Code e1 e1
Length 17 mm 17 mm
Memory Density 75497472 bit 75497472 bit
Memory IC Type ZBT SRAM CACHE SRAM
Memory Width 18 18
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 4MX18 4MX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.5 mm
Standby Voltage-Min 3.14 V
Supply Current-Max 0.5 mA
Supply Voltage-Max (Vsup) 3.6 V 2.7 V
Supply Voltage-Min (Vsup) 3.135 V 2.3 V
Supply Voltage-Nom (Vsup) 3.3 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 15 mm 15 mm
Base Number Matches 1 8
Pbfree Code Yes
Part Package Code BGA
Pin Count 165
ECCN Code 3A991.B.2.B
HTS Code 8542.32.00.41

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