CY7C1447AV25-133BGXC vs GS8324Z72C-250I feature comparison

CY7C1447AV25-133BGXC Cypress Semiconductor

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GS8324Z72C-250I GSI Technology

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description 14 X 22 MM, 1.76 MM HEIGHT, LEAD FREE, FBGA-209 LBGA,
Pin Count 209 209
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 6.5 ns 6 ns
Additional Feature FLOW-THROUGH ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE; IT CAN ALSO OPERATE WITH 3.3V SUPPLY
JESD-30 Code R-PBGA-B209 R-PBGA-B209
JESD-609 Code e1
Length 22 mm 22 mm
Memory Density 37748736 bit 37748736 bit
Memory IC Type CACHE SRAM ZBT SRAM
Memory Width 72 72
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 209 209
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 512KX72 512KX72
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 220
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.96 mm 1.7 mm
Supply Voltage-Max (Vsup) 2.625 V 2.7 V
Supply Voltage-Min (Vsup) 2.375 V 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 14 mm 14 mm
Base Number Matches 1 1

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