CY7C1447AV25-133BGXC
vs
GS832472GC-150IT
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
GSI TECHNOLOGY
Part Package Code
BGA
BGA
Package Description
14 X 22 MM, 1.76 MM HEIGHT, LEAD FREE, FBGA-209
LBGA,
Pin Count
209
209
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
6.5 ns
10 ns
Additional Feature
FLOW-THROUGH ARCHITECTURE
FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY
JESD-30 Code
R-PBGA-B209
R-PBGA-B209
JESD-609 Code
e1
e1
Length
22 mm
22 mm
Memory Density
37748736 bit
37748736 bit
Memory IC Type
CACHE SRAM
CACHE SRAM
Memory Width
72
72
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
209
209
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
512KX72
512KX72
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.96 mm
1.7 mm
Supply Voltage-Max (Vsup)
2.625 V
2.7 V
Supply Voltage-Min (Vsup)
2.375 V
2.3 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Width
14 mm
14 mm
Base Number Matches
1
1
Compare CY7C1447AV25-133BGXC with alternatives
Compare GS832472GC-150IT with alternatives