CY7C1386FV25-250BGI vs CY7C1324H-100AXC feature comparison

CY7C1386FV25-250BGI Cypress Semiconductor

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CY7C1324H-100AXC Cypress Semiconductor

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA QFP
Package Description 14 X 22 MM, 2.40 MM HEIGHT, BGA-119 LQFP,
Pin Count 119 100
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 2.6 ns 8 ns
Additional Feature PIPELINED ARCHITECTURE FLOW-THROUGH ARCHITECTURE
JESD-30 Code R-PBGA-B119 R-PQFP-G100
JESD-609 Code e0 e4
Length 22 mm 20 mm
Memory Density 18874368 bit 2359296 bit
Memory IC Type CACHE SRAM CACHE SRAM
Memory Width 36 18
Number of Functions 1 1
Number of Terminals 119 100
Number of Words 524288 words 131072 words
Number of Words Code 512000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 512KX36 128KX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LQFP
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.4 mm 1.6 mm
Supply Voltage-Max (Vsup) 2.625 V 3.6 V
Supply Voltage-Min (Vsup) 2.375 V 3.135 V
Supply Voltage-Nom (Vsup) 2.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form BALL GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position BOTTOM QUAD
Width 14 mm 14 mm
Base Number Matches 1 1
Pbfree Code Yes
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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