CY7C1354CV25-167AXC vs UPD4481361F9-A85-EQX feature comparison

CY7C1354CV25-167AXC Cypress Semiconductor

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UPD4481361F9-A85-EQX NEC Electronics Group

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP NEC ELECTRONICS CORP
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3.5 ns 8.5 ns
Clock Frequency-Max (fCLK) 167 MHz
I/O Type COMMON
JESD-30 Code R-PQFP-G100 R-PBGA-B165
JESD-609 Code e3
Memory Density 9437184 bit 9437184 bit
Memory IC Type ZBT SRAM ZBT SRAM
Memory Width 36 36
Moisture Sensitivity Level 3
Number of Terminals 100 165
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX36 256KX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP BGA
Package Equivalence Code QFP100,.63X.87
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.035 A
Standby Voltage-Min 2.38 V
Supply Current-Max 0.18 mA
Supply Voltage-Nom (Vsup) 2.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING BALL
Terminal Pitch 0.635 mm 1 mm
Terminal Position QUAD BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Base Number Matches 1 1
Part Package Code BGA
Package Description BGA,
Pin Count 165
Length 15 mm
Number of Functions 1
Supply Voltage-Max (Vsup) 3.465 V
Supply Voltage-Min (Vsup) 3.135 V
Width 13 mm

Compare CY7C1354CV25-167AXC with alternatives

Compare UPD4481361F9-A85-EQX with alternatives