CY7C1351B-50BGC
vs
AS7C332MNTF18A-85BCN
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
ALLIANCE SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
BGA, BGA119,7X17,50
TBGA,
Pin Count
119
165
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
12 ns
Additional Feature
FLOW-THROUGH ARCHITECTURE
Clock Frequency-Max (fCLK)
50 MHz
I/O Type
COMMON
JESD-30 Code
R-PBGA-B119
JESD-609 Code
e0
Length
22 mm
Memory Density
4718592 bit
Memory IC Type
ZBT SRAM
Memory Width
36
Number of Functions
1
Number of Terminals
119
Number of Words
131072 words
Number of Words Code
128000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
128KX36
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Equivalence Code
BGA119,7X17,50
Package Shape
RECTANGULAR
Package Style
GRID ARRAY
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
2.4 mm
Standby Current-Max
0.005 A
Standby Voltage-Min
3.14 V
Supply Current-Max
0.2 mA
Supply Voltage-Max (Vsup)
3.465 V
Supply Voltage-Min (Vsup)
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
Terminal Pitch
1.27 mm
Terminal Position
BOTTOM
Width
14 mm
Base Number Matches
1
1
Compare CY7C1351B-50BGC with alternatives
Compare AS7C332MNTF18A-85BCN with alternatives