CY7C1335L-100AC
vs
IDT7018L15PF9
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
QFP
Package Description
14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
Pin Count
100
100
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A991.B.2.B
3A991.B.2.B
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
5 ns
15 ns
I/O Type
COMMON
JESD-30 Code
R-PQFP-G100
R-PQFP-F100
JESD-609 Code
e0
e0
Length
20 mm
14 mm
Memory Density
1048576 bit
589824 bit
Memory IC Type
CACHE SRAM
MULTI-PORT SRAM
Memory Width
32
9
Number of Functions
1
1
Number of Ports
1
Number of Terminals
100
100
Number of Words
32768 words
65536 words
Number of Words Code
32000
64000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
32KX32
64KX9
Output Characteristics
3-STATE
Output Enable
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
QFF
Package Equivalence Code
QFP100,.63X.87
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.6 mm
Standby Current-Max
0.005 A
Standby Voltage-Min
3.14 V
Supply Current-Max
0.244 mA
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
3.135 V
4.5 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
FLAT
Terminal Pitch
0.65 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
14 mm
14 mm
Base Number Matches
1
1
Pbfree Code
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare CY7C1335L-100AC with alternatives
Compare IDT7018L15PF9 with alternatives