IDT7018L15PF9 vs CY7C009V-15AC feature comparison

IDT7018L15PF9 Integrated Device Technology Inc

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CY7C009V-15AC Rochester Electronics LLC

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC ROCHESTER ELECTRONICS LLC
Part Package Code QFP QFP
Package Description 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 PLASTIC, TQFP-100
Pin Count 100 100
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.B.2.B
HTS Code 8542.32.00.41
Access Time-Max 15 ns 15 ns
JESD-30 Code R-PQFP-F100 S-PQFP-G100
JESD-609 Code e0 e0
Length 14 mm 14 mm
Memory Density 589824 bit 1048576 bit
Memory IC Type MULTI-PORT SRAM DUAL-PORT SRAM
Memory Width 9 8
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 100 100
Number of Words 65536 words 131072 words
Number of Words Code 64000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 64KX9 128KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFF LFQFP
Package Shape RECTANGULAR SQUARE
Package Style FLATPACK FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 1.6 mm 1.6 mm
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form FLAT GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 14 mm 14 mm
Base Number Matches 1 2
Additional Feature INTERRUPT FLAG

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