CY7C1321KV18-333BZC
vs
IS61DDP2B21M36A-400B4L
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
INTEGRATED SILICON SOLUTION INC
Part Package Code
BGA
BGA
Package Description
13 X 15 MM, 1.40 MM HEIGHT, MO-216BB0AC, FBGA-165
LBGA,
Pin Count
165
165
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
0.45 ns
0.45 ns
Additional Feature
PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
333 MHz
I/O Type
COMMON
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
Length
15 mm
15 mm
Memory Density
18874368 bit
37748736 bit
Memory IC Type
DDR SRAM
DDR SRAM
Memory Width
36
36
Number of Functions
1
1
Number of Terminals
165
165
Number of Words
524288 words
1048576 words
Number of Words Code
512000
1000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
512KX36
1MX36
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA165,11X15,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
SERIAL
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
1.4 mm
1.4 mm
Standby Current-Max
0.27 A
Standby Voltage-Min
1.7 V
Supply Current-Max
0.44 mA
Supply Voltage-Max (Vsup)
1.9 V
1.89 V
Supply Voltage-Min (Vsup)
1.7 V
1.71 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
13 mm
13 mm
Base Number Matches
1
2
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
Compare CY7C1321KV18-333BZC with alternatives
Compare IS61DDP2B21M36A-400B4L with alternatives