CY7C1041CV33-10BAXE
vs
IS61WV25616MEBLL-10TLI
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
INTEGRATED SILICON SOLUTION INC
Part Package Code
BGA
Package Description
7 X 8.50 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-48
TSOP2,
Pin Count
48
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
10 ns
10 ns
JESD-30 Code
R-XBGA-B48
R-PDSO-G44
JESD-609 Code
e1
Length
8.5 mm
18.41 mm
Memory Density
4194304 bit
4194304 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
16
16
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
48
44
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
256KX16
256KX16
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
TFBGA
TSOP2
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
2.4 V
Supply Voltage-Nom (Vsup)
3.3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
GULL WING
Terminal Pitch
0.75 mm
0.8 mm
Terminal Position
BOTTOM
DUAL
Width
7 mm
10.16 mm
Base Number Matches
1
1
Date Of Intro
2017-03-08
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare CY7C1041CV33-10BAXE with alternatives
Compare IS61WV25616MEBLL-10TLI with alternatives