CY7C1034DV33-8BGXC vs EDI8L24257V10BC feature comparison

CY7C1034DV33-8BGXC Cypress Semiconductor

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EDI8L24257V10BC White Microelectronics

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP WHITE MICROELECTRONICS
Part Package Code BGA
Package Description BGA, BGA119,7X17,50 MO-163, BGA-119
Pin Count 119
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 8 ns 10 ns
I/O Type COMMON
JESD-30 Code R-PBGA-B119 R-PBGA-B119
JESD-609 Code e1
Length 22 mm
Memory Density 6291456 bit 6291456 bit
Memory IC Type STANDARD SRAM SRAM MODULE
Memory Width 24 24
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 119 119
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX24 256KX24
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA119,7X17,50
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.4 mm
Standby Current-Max 0.025 A
Standby Voltage-Min 2 V
Supply Current-Max 0.185 mA
Supply Voltage-Max (Vsup) 3.6 V 3.465 V
Supply Voltage-Min (Vsup) 3 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 14 mm
Base Number Matches 1 1

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