EDI8L24257V10BC
vs
GS76024GB-12I
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
WHITE MICROELECTRONICS
|
GSI TECHNOLOGY
|
| Package Description |
MO-163, BGA-119
|
BGA,
|
| Reach Compliance Code |
unknown
|
compliant
|
| Access Time-Max |
10 ns
|
12 ns
|
| JESD-30 Code |
R-PBGA-B119
|
R-PBGA-B119
|
| Memory Density |
6291456 bit
|
6291456 bit
|
| Memory IC Type |
SRAM MODULE
|
STANDARD SRAM
|
| Memory Width |
24
|
24
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
119
|
119
|
| Number of Words |
262144 words
|
262144 words
|
| Number of Words Code |
256000
|
256000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
256KX24
|
256KX24
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
3.465 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
3.135 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
119
|
| ECCN Code |
|
3A991.B.2.A
|
| HTS Code |
|
8542.32.00.41
|
| JESD-609 Code |
|
e1
|
| Length |
|
22 mm
|
| Moisture Sensitivity Level |
|
3
|
| Package Code |
|
BGA
|
| Seated Height-Max |
|
2.4 mm
|
| Terminal Finish |
|
TIN SILVER COPPER
|
| Terminal Pitch |
|
1.27 mm
|
| Width |
|
14 mm
|
|
|
|
Compare EDI8L24257V10BC with alternatives
Compare GS76024GB-12I with alternatives