CY7C1034DV33-10BGXI vs GS76024AB-12T feature comparison

CY7C1034DV33-10BGXI Infineon Technologies AG

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GS76024AB-12T GSI Technology

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INFINEON TECHNOLOGIES AG GSI TECHNOLOGY
Package Description BGA-119 BGA,
Reach Compliance Code compliant compliant
Factory Lead Time 2 Days
Samacsys Manufacturer Infineon
Access Time-Max 10 ns 12 ns
I/O Type COMMON
JESD-30 Code R-PBGA-B119 R-PBGA-B119
Length 22 mm 22 mm
Memory Density 6291456 bit 6291456 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 24 24
Number of Functions 1 1
Number of Ports 1
Number of Terminals 119 119
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 256KX24 256KX24
Output Characteristics 3-STATE
Output Enable YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA119,7X17,50
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED 220
Seated Height-Max 2.4 mm 1.99 mm
Standby Current-Max 0.025 A
Standby Voltage-Min 2 V
Supply Current-Max 0.175 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 14 mm 14 mm
Base Number Matches 2 1
Pbfree Code No
Part Package Code BGA
Pin Count 119
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
JESD-609 Code e0
Moisture Sensitivity Level 3
Qualification Status Not Qualified
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD

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