Part Details for CY7C1034DV33-10BGXI by Infineon Technologies AG
Overview of CY7C1034DV33-10BGXI by Infineon Technologies AG
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for CY7C1034DV33-10BGXI
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
CY7C1034DV33-10BGX
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Avnet Americas | SRAM Chip Async Single 3.3V 6M-Bit 256K x 24-Bit 10ns 119-Pin BGA - Trays (Alt: CY7C1034DV33-10BGX) RoHS: Compliant Min Qty: 12 Package Multiple: 1 Lead time: 4 Weeks, 0 Days Container: Tray | 1545 Partner Stock |
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$25.8700 / $31.9600 | Buy Now |
DISTI #
CY7C1034DV33-10BGX
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Avnet Americas | SRAM Chip Async Single 3.3V 6M-Bit 256K x 24-Bit 10ns 119-Pin BGA - Trays (Alt: CY7C1034DV33-10BGX) RoHS: Compliant Min Qty: 57 Package Multiple: 1 Lead time: 0 Weeks, 2 Days Container: Tray | 219 Partner Stock |
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$10.9368 / $13.2300 | Buy Now |
Part Details for CY7C1034DV33-10BGXI
CY7C1034DV33-10BGXI CAD Models
CY7C1034DV33-10BGXI Part Data Attributes
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CY7C1034DV33-10BGXI
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
CY7C1034DV33-10BGXI
Infineon Technologies AG
Standard SRAM, 256KX24, 10ns, CMOS, PBGA119, BGA-119
|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Package Description | BGA-119 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 2 Days | |
Samacsys Manufacturer | Infineon | |
Access Time-Max | 10 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-PBGA-B119 | |
Length | 22 mm | |
Memory Density | 6291456 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 24 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 119 | |
Number of Words | 262144 words | |
Number of Words Code | 256000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 256KX24 | |
Output Characteristics | 3-STATE | |
Output Enable | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA119,7X17,50 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Seated Height-Max | 2.4 mm | |
Standby Current-Max | 0.025 A | |
Standby Voltage-Min | 2 V | |
Supply Current-Max | 0.175 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 3 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 14 mm |