CY7C1021CV33-12BAI vs K6R1016V1C-FI120 feature comparison

CY7C1021CV33-12BAI Rochester Electronics LLC

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K6R1016V1C-FI120 Samsung Semiconductor

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA
Package Description 7 X 7 MM, 1.20 MM HEIGHT, FBGA-48
Pin Count 48
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.B 3A991.B.2.B
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 12 ns 12 ns
JESD-30 Code S-PBGA-B48 R-PBGA-B48
JESD-609 Code e0
Length 7 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Moisture Sensitivity Level 3 3
Number of Functions 1
Number of Terminals 48 48
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 64KX16 64KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA FBGA
Package Shape SQUARE RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 3.63 V
Supply Voltage-Min (Vsup) 2.97 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7 mm
Base Number Matches 2 1
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code BGA48,6X8,30
Standby Current-Max 0.005 A
Standby Voltage-Min 3 V
Supply Current-Max 0.095 mA

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