CY7C1009-20DMB
vs
5962-8959838MZA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
MICROSEMI CORP
Part Package Code
DIP
DIP
Package Description
0.300 INCH, CERDIP-32
DIP,
Pin Count
32
32
Reach Compliance Code
compliant
compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
20 ns
20 ns
Additional Feature
AUTOMATIC POWER-DOWN
I/O Type
COMMON
JESD-30 Code
R-GDIP-T32
R-XDIP-T32
JESD-609 Code
e0
Length
42.2275 mm
40.64 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Ports
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
128KX8
128KX8
Output Characteristics
3-STATE
Output Enable
YES
Package Body Material
CERAMIC, GLASS-SEALED
UNSPECIFIED
Package Code
DIP
DIP
Package Equivalence Code
DIP32,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class C
MIL-STD-883
Seated Height-Max
5.08 mm
5.89 mm
Standby Current-Max
0.002 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.17 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
10 mm
Base Number Matches
1
14
Pbfree Code
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare CY7C1009-20DMB with alternatives
Compare 5962-8959838MZA with alternatives