CY7C09579V-100BBXC vs CY7C057V-15BBC feature comparison

CY7C09579V-100BBXC Cypress Semiconductor

Buy Now Datasheet

CY7C057V-15BBC Rochester Electronics LLC

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Active
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP ROCHESTER ELECTRONICS LLC
Part Package Code BGA BGA
Package Description LBGA, 15 X 15 MM, 1.25 MM HEIGHT, 1 MM PITCH, BGA-172
Pin Count 172 172
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 12.5 ns 15 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 Code S-PBGA-B172 S-PBGA-B172
JESD-609 Code e1 e0
Length 15 mm 15 mm
Memory Density 1179648 bit 1179648 bit
Memory IC Type MULTI-PORT SRAM DUAL-PORT SRAM
Memory Width 36 36
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 172 172
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 32KX36 32KX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 220
Seated Height-Max 1.25 mm 1.25 mm
Supply Voltage-Max (Vsup) 3.465 V 3.465 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 NOT SPECIFIED
Width 15 mm 15 mm
Base Number Matches 1 2
Qualification Status COMMERCIAL

Compare CY7C09579V-100BBXC with alternatives