CY74FCT374TQC
vs
5962-9221802MRA
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
ROCHESTER ELECTRONICS INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
QSOP
DIP
Package Description
SSOP,
DIP,
Pin Count
20
20
Reach Compliance Code
unknown
unknown
Additional Feature
POWER OFF DISABLE OUTPUTS TO PERMIT LIVE INSERTION
Family
FCT
FCT
JESD-30 Code
R-PDSO-G20
R-GDIP-T20
JESD-609 Code
e0
e0
Length
8.65 mm
24.13 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Moisture Sensitivity Level
NOT SPECIFIED
Number of Bits
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
20
20
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
SSOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
10 ns
11 ns
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
1.75 mm
5.08 mm
Supply Voltage-Max (Vsup)
5.25 V
5.5 V
Supply Voltage-Min (Vsup)
4.75 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.635 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
3.9116 mm
7.62 mm
Base Number Matches
1
1
HTS Code
8542.39.00.01
Load Capacitance (CL)
50 pF
Package Equivalence Code
DIP20,.3
Screening Level
MIL-STD-883
Compare CY74FCT374TQC with alternatives
Compare 5962-9221802MRA with alternatives