CY62256LL-70SNXC
vs
MB84256C-70LPFER
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
FUJITSU SEMICONDUCTOR AMERICA INC
Part Package Code
SOIC
Package Description
0.300 INCH, LEAD FREE, SOIC-28
SOP,
Pin Count
28
Reach Compliance Code
unknown
compliant
Access Time-Max
70 ns
70 ns
JESD-30 Code
R-PDSO-G28
R-PDSO-G28
JESD-609 Code
e4
e0
Length
17.9324 mm
17.75 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
32KX8
32KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
2.794 mm
2.8 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
NICKEL PALLADIUM GOLD
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
20
Width
7.5057 mm
8.6 mm
Base Number Matches
2
2
ECCN Code
EAR99
HTS Code
8542.32.00.41
Compare MB84256C-70LPFER with alternatives