CY62167DV30LL-55ZI
vs
CY62167EV30LL-45ZXIT
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
TSOP1
TSOP1
Package Description
12 X 18.40 MM, 1 MM HEIGHT, MO-142, TSOP1-48
12 X 18.40 MM, 1 MM HEIGHT, MO-142, ROHS COMPLIANT, TSOP1-48
Pin Count
48
48
Reach Compliance Code
unknown
compliant
Access Time-Max
55 ns
45 ns
Additional Feature
CONFIGURABLE AS 2M X 8 ALSO
JESD-30 Code
R-PDSO-G48
R-PDSO-G48
JESD-609 Code
e0
e3
Length
18.4 mm
18.4 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
16
16
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
1MX16
1MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
TSOP1
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
235
260
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.2 V
2.2 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Matte Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
20
Width
12 mm
12 mm
Base Number Matches
2
2
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Alternate Memory Width
8
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
TSSOP48,.8,20
Standby Voltage-Min
1.5 V
Supply Current-Max
0.03 mA
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