Part Details for CY62167DV30LL-55ZI by Rochester Electronics LLC
Overview of CY62167DV30LL-55ZI by Rochester Electronics LLC
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Part Details for CY62167DV30LL-55ZI
CY62167DV30LL-55ZI CAD Models
CY62167DV30LL-55ZI Part Data Attributes
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CY62167DV30LL-55ZI
Rochester Electronics LLC
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CY62167DV30LL-55ZI
Rochester Electronics LLC
1MX16 STANDARD SRAM, 55ns, PDSO48, 12 X 18.40 MM, 1 MM HEIGHT, MO-142, TSOP1-48
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
| Part Package Code | TSOP1 | |
| Package Description | 12 X 18.40 MM, 1 MM HEIGHT, MO-142, TSOP1-48 | |
| Pin Count | 48 | |
| Reach Compliance Code | unknown | |
| Access Time-Max | 55 ns | |
| Additional Feature | CONFIGURABLE AS 2M X 8 ALSO | |
| JESD-30 Code | R-PDSO-G48 | |
| JESD-609 Code | e0 | |
| Length | 18.4 mm | |
| Memory Density | 16777216 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 16 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 48 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 1MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSOP1 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 235 | |
| Qualification Status | COMMERCIAL | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.2 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 12 mm |