CY62128BLL-55SXC
vs
K6X1008C2D-BF550
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
SAMSUNG SEMICONDUCTOR INC
Part Package Code
SOIC
SOIC
Package Description
0.450 INCH, LEAD FREE, SOIC-32
SOP, SOP32,.56
Pin Count
32
32
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
55 ns
55 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PDSO-G32
R-PDSO-G32
JESD-609 Code
e4
Length
20.4465 mm
20.47 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Moisture Sensitivity Level
3
2
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
128KX8
128KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP32,.56
SOP32,.56
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.997 mm
3 mm
Standby Current-Max
0.000015 A
0.00001 A
Standby Voltage-Min
2 V
2 V
Supply Current-Max
0.02 mA
0.025 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
20
Width
11.303 mm
11.43 mm
Base Number Matches
1
1
Compare CY62128BLL-55SXC with alternatives
Compare K6X1008C2D-BF550 with alternatives