CY37384P256-125BGC
vs
CY37512P256-125BGI
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
CYPRESS SEMICONDUCTOR CORP
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA-256
|
27 X 27 MM, 2.33 MM HEIGHT, BGA-256
|
Pin Count |
256
|
256
|
Reach Compliance Code |
not_compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
384 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
|
YES
|
Clock Frequency-Max |
83 MHz
|
83 MHz
|
In-System Programmable |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
JESD-609 Code |
e0
|
e0
|
JTAG BST |
YES
|
YES
|
Length |
27 mm
|
|
Number of Dedicated Inputs |
1
|
1
|
Number of I/O Lines |
197
|
192
|
Number of Macro Cells |
384
|
512
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
1 DEDICATED INPUTS, 197 I/O
|
1 DEDICATED INPUTS, 192 I/O
|
Output Function |
MACROCELL
|
MACROCELL
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA256,20X20,50
|
BGA256,20X20,50
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Programmable Logic Type |
EE PLD
|
EE PLD
|
Propagation Delay |
10 ns
|
10 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.46 mm
|
|
Supply Voltage-Max |
5.25 V
|
5.5 V
|
Supply Voltage-Min |
4.75 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
27 mm
|
|
Base Number Matches |
1
|
1
|
|
|
|
Compare CY37384P256-125BGC with alternatives
Compare CY37512P256-125BGI with alternatives